Cadence SSV Release Version 22.11.100 (Linux)

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Free Download Cadence SSV Release Version 22.11.100 | 23.6 Gb
The SSV Release Team has unveiled theCadence Silicon Signoff and Verification (SSV) 22.10.000. This solution encapsulates a set of tools that address a series of electrical and physical signoff and verification steps that designers must perform on their design before tapeout.
Owner:Cadence
Product Name:Silicon Signoff and Verification (SSV)
Version:22.10.000 (Base Release) - 22.11.100-ISR1 *
Supported Architectures:x86_64
Website Home Page :www.cadence.com
Languages Supported:english
System Requirements:Linux **
Size:23.6 Gb​




Voltus

Performance and Capacity Enhancements
The following enhancements have been made to increase the performance and capacity and provide a better user experience for large designs:
- Support for localized disk data caching to retrieve information quickly and speed up the processing time
- Enhanced capacity for die-model generation by using the advanced Model Order Reduction (MOR) techniques
- Improved the method for fracturing Non-Manhattan shapes, enabling current-aware modeling of the shapes
- Enhanced algorithm for hierarchical net-tracing in designs with many hierarchies
Simplified Use Model for Power Analysis Flows
A new seamless unified solution, "Event-Based Power Analysis," has been introduced to support multiple power analysis flows simultaneously. In this model, the tool performs accurate state-based power estimation for all events of a scenario in a design. Event-Based Power Analysis is applicable to all event-based vectors, such as VCD, FSDB, SHM, and PHY. The use model for event-based power analysis is: set_power_analysis_mode -method event_based.
New Smart Windows Feature
Voltus introduces the new smart window feature for extracting peak power scenarios from a vector-based activity file. The smart window is a variable size window that enables designers to capture maximum regions of high power dissipation.
Support for Multi-Die Self-Heating Effect Flow
Voltus now supports the multi-die Self-Heating Effect (SHE) analysis flow to understand the effect of temperature variations in gate-level designs. Previously, the SHE flow was supported only in the single-die mode using the analyze_self_heat command.

Read more here
Code:
https://paste2.org/Xs32xCbU
http://peeplink.in/91f65989b736





Supported OS and Platform Levels
This build is based on the 2022 platform support matrix, linux only. From this release onwards RH7.4 is the minimum requirement and won't run on RH6.X.
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